Deposited-film forming process and deposited-film forming apparatus
US6350489B1 · kind B1 · utility
21Cited by
8References
93Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 18, 1996 |
| Grant date | Feb 26, 2002 |
| Priority date | — |
| Expiry date | Dec 18, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/545
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
To provide a deposited-film forming process and a deposited-film forming apparatus that may cause no scratches on the film forming surface to improve yield and enable stable discharge to thereby continuously form deposited films having uniform quality and uniform thickness, deposited films are formed by lengthwise continuously transporting a belt-like substrate so as to form a part of a discharge space, wherein the substrate is transported while bringing the transverse sectional shape of the substrate which forms a part of the discharge space into a curved shape by a roller.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.