System and method of heat extraction from an integrated circuit die
US6351387B1 · kind B1 · utility
11Cited by
9References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 29, 2000 |
| Grant date | Feb 26, 2002 |
| Priority date | — |
| Expiry date | Jun 29, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation system and method for extracting heat from an integrated circuit die includes attaching an integrated circuit die to a heat extraction substrate capable of extracting heat from the integrated circuit die. Further, a heat transport medium is attached to the heat extraction substrate, to transport the extracted heat from the heat extraction substrate to ambient. In some embodiments, the heat dissipation device can further include a heat sink, attached to the heat transport medium, to further facilitate the transporting of the heat from the heat transport medium to ambient.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.