Ravi Prasher
36Patents
16h-index
42Co-inventors
81Inventor score
Filing activity: Jun 29, 2000 → Jul 8, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6992382B2 | Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon | Electricity | 64 | Expired |
| US6381135B1 | Loop heat pipe for mobile computers | Mechanical Engineering; Lighting; Heating | 55 | Expired |
| US6903929B2 | Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink | Electricity | 49 | Expired |
| US6934154B2 | Micro-channel heat exchangers and spreaders | Electricity | 46 | Expired |
| US6535386B2 | Electronic assembly having a heat pipe that conducts heat from a semiconductor die | Electricity | 40 | Expired |
| US6661660B2 | Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment | Electricity | 36 | Expired |
| US6639799B2 | Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment | Electricity | 28 | Expired |
| US7435623B2 | Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon | Electricity | 28 | Expired |
| US7104313B2 | Apparatus for using fluid laden with nanoparticles for application in electronic cooling | Electricity | 24 | Expired |
| US7259965B2 | Integrated circuit coolant microchannel assembly with targeted channel configuration | Electricity | 24 | Expired |
| US6469893B1 | Direct heatpipe attachment to die using center point loading | Electricity | 23 | Expired |
| US7957137B2 | Method for cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel | Electricity | 23 | Active |
| US6696635B2 | Thermoelectrically cooling electronic devices | Emerging Cross-Sectional Technologies | 22 | Expired |
| US7115987B2 | Integrated stacked microchannel heat exchanger and heat spreader | Electricity | 21 | Expired |
| US7253523B2 | Reworkable thermal interface material | Electricity | 16 | Expired |
| US6625022B2 | Direct heatpipe attachment to die using center point loading | Electricity | 16 | Expired |
| US6365821B1 | Thermoelectrically cooling electronic devices | Emerging Cross-Sectional Technologies | 16 | Expired |
| US6903930B2 | Parallel heat exchanger for a component in a mobile system | Electricity | 14 | Expired |
| US7212405B2 | Method and apparatus for providing distributed fluid flows in a thermal management arrangement | Electricity | 14 | Expired |
| US6504721B1 | Thermal cooling apparatus | Physics | 13 | Expired |
| US6906919B2 | Two-phase pumped liquid loop for mobile computer cooling | Physics | 13 | Expired |
| US7218519B2 | Thermal management arrangement with a low heat flux channel flow coupled to high heat flux channels | Electricity | 13 | Expired |
| US6981849B2 | Electro-osmotic pumps and micro-channels | Electricity | 12 | Expired |
| US6351387B1 | System and method of heat extraction from an integrated circuit die | Emerging Cross-Sectional Technologies | 11 | Expired |
| US7633752B2 | Cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel | Electricity | 8 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.