Device and method for packaging an electronic device
US6351389B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | May 7, 1996 |
| Grant date | Feb 26, 2002 |
| Priority date | — |
| Expiry date | May 7, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for packaging an electronic device, such as an integrated circuit chip (8), includes an intermediate device carrier (6) with a substantially planar upper surface (16) and a plurality of bonding pads (18) for coupling the carrier to the integrated circuit chip. A ceramic ring (38) is attached to the upper surface of the device carrier and a thermally conductive cover plate (36) is attached to the ceramic ring to form an inner cavity for receiving the chip therein. The ceramic ring comprises a material with a coefficient of thermal expansion substantially similar to or as the same as the device carrier to minimize stress therebetween during thermal expansion or contraction of the package device. The thermally conductive cover plate provides a path for dissipating heat generated during electrical operations of the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.