Semiconductor processing workpiece position sensing
US6351682B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 1, 1999 |
| Grant date | Feb 26, 2002 |
| Priority date | — |
| Expiry date | Sep 1, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides semiconductor workpiece position sensors and methods of monitoring the position of a semiconductor workpiece. One embodiment of the invention provides a method of monitoring position of a semiconductor workpiece including providing a process module including a process container having a process fluid therein and a workpiece holder configured to support the semiconductor workpiece, moving the semiconductor workpiece toward the process fluid within the process container, applying a reference signal to the process module, and indicating position of the semiconductor workpiece with respect to the process fluid responsive to the reference signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.