System for forming bonded storage disks with low power light assembly
US6352612B1 · kind B1 · utility
0Cited by
24References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 19, 1998 |
| Grant date | Mar 5, 2002 |
| Priority date | — |
| Expiry date | May 19, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B23/0021
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A system and method cure a resin disposed between a combination of a top substrate and a bottom substrate with low power. One of the top and bottom substrates includes metallized data pits. Resin-curing light is directed at sides of the data pits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.