Patent · US Expired

Apparatus and method for producing a chip-substrate connection

US6353202B1 · kind B1 · utility

47Cited by

5References

20Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Stefan Grötsch · Regensburg, DE
Hans-Ludwig Althaus · Lappersdorf, DE
Werner Spath · Holzkirchen, DE
Georg Bogner · Lappersdorf, DE

Key dates

Filing date	Jan 24, 2000
Grant date	Mar 5, 2002
Priority date	—
Expiry date	Jan 24, 2020

Classification

Technology area (CPC H)Electricity
CPC primaryH05K3/3494
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

An apparatus for producing a chip-substrate connection, in particular by soldering a semiconductor chip on a substrate. The apparatus has a support, on which the substrate is temporarily supported, and a heating device which is provided for forming the chip-substrate connection. The heating device has a radiation source in the form of a laser in the infrared wavelength range. The support is formed by a heat body, which is assigned to the chip-substrate connection and is heated with thermal radiation by the radiation source. A surface of the heat body is coated with a material, in particular a material containing chromium, exhibiting high absorption with respect to the light radiation emitted by the radiation source.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.