Semiconductor module
US6353258B1 · kind B1 · utility
28Cited by
6References
44Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jun 26, 2000 |
| Grant date | Mar 5, 2002 |
| Priority date | — |
| Expiry date | Jun 26, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor module has a plurality of power semiconductor devices mounted on a substrate, and a metal foil for wiring is mounted on the substrate so that an asymmetric unit arrangement of the semiconductor devices is formed. In the device, all of the units are arranged in the same direction on the substrate, and all of the units are electrically connected with electrode terminal feet, and the electrode terminal feet are electrically connected with linkage terminal foot. The electrode terminal feet are disposed with a certain interval.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.