Extreme-UV scanning wafer and reticle stages
US6353271B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 29, 1999 |
| Grant date | Mar 5, 2002 |
| Priority date | — |
| Expiry date | Oct 29, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70716
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A stage for precise positioning of a chuck in three orthogonal linear axes and in three orthogonal rotation axes that includes first and second subassemblies. The a first subassembly includes (i) a monolithic mirror that supports the chuck wherein the monolithic mirror has at least two polished orthogonal faces for interferometric determination of the X, Y, and &THgr;z positions; (ii) a plurality of electromagnetic actuators that control fine positioning in all six axes and coarse positioning in one axis; (iii) a position sensor for measuring the vertical Z position of the monolithic mirror; and (iv) a Lorentz actuator, that includes magnet array, for effecting motion in the Y axis. The a second subassembly comprising a stepping axis beam over which the first subassembly is suspended, wherein the stepping axis beam includes a drive coil array for the Lorentz actuator. T the stage can also include a cable stage subassembly that is positioned a fixed distance away from the monolithic mirror and/or a mechanical zero reference for the first subassembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.