Method and apparatus for matched length routing of back-to-back package placement
US6353539B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 21, 1998 |
| Grant date | Mar 5, 2002 |
| Priority date | — |
| Expiry date | Jul 21, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10545
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board includes a first component mounted on a first side of the printed circuit board. A second component has an identical pin-out as the first component. The second component is mounted on a second side of the printed circuit board. A first signal line connects a first landpad coupled to a first contact on the first component with a second landpad coupled to a corresponding first contact on the second component. A second signal line connects a third landpad coupled to a second contact on the first component with a fourth land pad coupled to a corresponding second contact on the second component. The first signal line has is equal in length to the second signal line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.