Process for treating a semiconductor substrate
US6354309B1 · kind B1 · utility
5Cited by
13References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2000 |
| Grant date | Mar 12, 2002 |
| Priority date | — |
| Expiry date | Sep 29, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/30604
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor substrates are contacted with a deionized water solution containing an acidic material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.