Modified plating solution for plating and planarization and process utilizing same
US6354916B1 · kind B1 · utility
34Cited by
44References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 6, 2000 |
| Grant date | Mar 12, 2002 |
| Priority date | — |
| Expiry date | Apr 6, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A modified plating solution that can be used to electroplate a high quality conductive material that can be effectively polished and planarized includes (1) a solvent, (2) an ionic species of the conductive material to be deposited, (3) at least one additive to improve electrical and structural properties, and (4) a modifying agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.