Method and apparatus for cutting a wafer
US6357330B1 · kind B1 · utility
13Cited by
16References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 7, 1999 |
| Grant date | Mar 19, 2002 |
| Priority date | — |
| Expiry date | Jan 7, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/541
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A wafer cutting apparatus which includes a wafer saw, a detector, and a control unit. The detector detects a variable of a wafer being sawed. The control unit utilizes the variable to control the saw.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.