Silicon support members for wafer processing fixtures
US6357432B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2001 |
| Grant date | Mar 19, 2002 |
| Priority date | — |
| Expiry date | Jan 29, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67306
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of fabricating support members for wafer processing fixtures and the produce are disclosed. In the first step of the method, an elongate support member basic form is provided. The basic form has a substantially wedge-shaped cross-section and angular comers. A plurality of wafer-retaining slots are cut along one side of the support member basic form. The support member basic form can include a front surface and a rear surface, with at least one angular comer occurring on each of the surfaces. The comers have a larger radius on the rear than in the front. Attachment structures on terminal ends can be fixed to bases. The elongate support member basic form can be fabricated from an inert crystalline material, such as polycrystalline silicon or monocrystalline silicon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.