Method of forming bumps on wafers or substrates
US6358834B1 · kind B1 · utility
3Cited by
3References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2000 |
| Grant date | Mar 19, 2002 |
| Priority date | — |
| Expiry date | Oct 16, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of forming metal bumps on a wafer includes the steps of adhering a heat-resistant and steady synthetic tape on the top of the wafer, punching holes through the synthetic tape to form a blind hole on the synthetic tape above the under-bump-metallurgy layer (UBM), filling solder paste into the blind hole by a pusher, melting and then cooling the solder paste into a solder block removing the synthetic tape to expose the solder block, and melting the solder block to form a ball-shaped solder bump.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.