Patent · US Expired

Method for planarizing photoresist

US6361402B1 · kind B1 · utility

13Cited by

2References

22Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Donald F. Canaperi · Bridgewater, US
Rangarajan Jagannathan · Hopewell Junction, US
Mahadevaiyer Krishnan · Hopewell Junction, US
Max G. Levy · South Burlington, US
Uma Satyendra · Wappingers Falls, US
Matthew Sendelbach · Fishkill, US
James A. Tornello · Somers, US
William C. Wille · Red Hook, US

Key dates

Filing date	Oct 26, 1999
Grant date	Mar 26, 2002
Priority date	—
Expiry date	Oct 26, 2019

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/76819
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A method for polishing an object having a layer of photoresist, the method, employing the following steps:a) applying a layer of slurry on an a layer of photoresist on an object having a first and a second side, the layer of photoresist on one of the first and second side, the object having a center axis perpendicular to the first and second side;b) contacting the layer of slurry with a pad having a first and second side, the first side of the pad exerting a force on the slurry.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.