Polymeric polishing pad having improved surface layer and method of making same
US6361409B1 · kind B1 · utility
11Cited by
12References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 1999 |
| Grant date | Mar 26, 2002 |
| Priority date | — |
| Expiry date | Sep 28, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/28
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad made of polymeric material has an improved surface layer which is provided by treating a surface of the polishing pad with a chemical solvent. Solubility parameter is used to select a suitable chemical solvent. The treated polishing pad can be conditioned in substantially less time than an untreated pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.