Method and apparatus for transferring semiconductor substrates using an input module
US6361422B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2000 |
| Grant date | Mar 26, 2002 |
| Priority date | — |
| Expiry date | Apr 11, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68707
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor substrate processing method and apparatus, more specifically, a method and apparatus for polishing a substrate or semiconductor wafer in a polishing system. In one embodiment, the system includes one or more polishing modules, an input module, a first robot and a second robot that provides a compact polishing system that has a minimal tool footprint. The first robot is adapted to transfer the substrate to the input module, while the second robot is adapted to transfer the substrate between the input module and the one or more polishing modules. In another embodiment, the first and second robots have rotary actuators coupled to their grippers that enable the substrate to be orientated between a horizontal and vertical position. The input module is adapted to maintain the substrate in a vertical orientation. The vertical orientation of the substrates facilitates integration of a cleaning system that cleans the substrates while in the vertical orientation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.