Paste application method for die bonding
US6361831B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 6, 2000 |
| Grant date | Mar 26, 2002 |
| Priority date | — |
| Expiry date | Apr 6, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/07802
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A paste applicator and paste application method for die bonding apply paste to adhere a semiconductor chip on a substrate. Data on paste application volume and application pattern which can be identified from paste thickness and chip size are stored. A dispensing flow rate calculator calculates dispensing flow rate of a dispenser based on the paste application volume data and application pattern data when the paste is dispensed from the dispenser and pressure fed to an application nozzle for applying paste. Based on this calculated dispensing flow rate and application pattern data, a dispenser controller controls the dispenser and a transfer table controller controls the transfer table for moving the application nozzle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.