Mitsuru Ozono
18Patents
6h-index
15Co-inventors
59Inventor score
Filing activity: Sep 11, 1997 → Feb 9, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6361831B1 | Paste application method for die bonding | Electricity | 26 | Expired |
| US6797544B2 | Semiconductor device, method of manufacturing the device and method of mounting the device | Electricity | 23 | Expired |
| US6179198A | Method of soldering bumped work by partially penetrating the oxide film covering the solder bumps | Emerging Cross-Sectional Technologies | 21 | Expired |
| US6209196A | Method of mounting bumped electronic components | Emerging Cross-Sectional Technologies | 21 | Expired |
| US7632374B2 | Method and apparatus for picking up semiconductor chip and suction and exfoliation tool used therefor | Emerging Cross-Sectional Technologies | 11 | Expired |
| US8614118B2 | Component bonding method, component laminating method and bonded component structure | Electricity | 9 | Active |
| US7632710B2 | Method for soldering electronic component and soldering structure of electronic component | Emerging Cross-Sectional Technologies | 6 | Active |
| US6348234B1 | Paste applying method | Electricity | 6 | Expired |
| US6605315B1 | Bonding paste applicator and method of using it | Emerging Cross-Sectional Technologies | 5 | Expired |
| US8192578B2 | Chip pickup apparatus, chip pickup method, chip releasing device and chip releasing method | Emerging Cross-Sectional Technologies | 5 | Active |
| US7446423B2 | Semiconductor device and method for assembling the same | Emerging Cross-Sectional Technologies | 5 | Expired |
| US6617675B2 | Semiconductor device and semiconductor device assembly | Electricity | 3 | Expired |
| US8148253B2 | Electronic component soldering structure and electronic component soldering method | Emerging Cross-Sectional Technologies | 2 | Active |
| US7409761B2 | Electronic component mounting apparatus and method of mounting electronic components | Emerging Cross-Sectional Technologies | 2 | Expired |
| US6808086B2 | Paste ejection apparatus | Mechanical Engineering; Lighting; Heating | 1 | Expired |
| US6685777B2 | Paste applicator and paste application method for die bonding | Electricity | 1 | Expired |
| US6852572B2 | Method of manufacturing semiconductor device | Electricity | 1 | Expired |
| US6460756B2 | Method of applying bonding paste | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.