Method for polishing a substrate using a CMP slurry
US6362104B1 · kind B1 · utility
14Cited by
4References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 10, 2000 |
| Grant date | Mar 26, 2002 |
| Priority date | — |
| Expiry date | Feb 10, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A chemical mechanical polishing composition comprising an oxidizing agent and at least one solid catalyst, the composition being useful when combined with an abrasive or with an abrasive pad to remove multiple metal layers from a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.