Multilayer printed circuit board with placebo vias for controlling interconnect skew
US6362973B1 · kind B1 · utility
9Cited by
16References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2000 |
| Grant date | Mar 26, 2002 |
| Priority date | — |
| Expiry date | Mar 14, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09781
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-layer printed circuit board that includes a first layer and a second layer that have first and second signal traces, respectively. The multi-layer printed circuit board includes a via that couples a signal transmitting component to the second signal trace and a throttling member, which is coupled to the first signal trace. The throttling member reduces the speed at which a first signal routed over the first signal trace travels when compared to the speed at which that signal would have traveled had the throttling member been absent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.