Ultra high temperature transducer structure
US6363792B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 9, 1999 |
| Grant date | Apr 2, 2002 |
| Priority date | — |
| Expiry date | Apr 9, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L19/04
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A hermetically sealed high temperature pressure transducer assembly including: a sensor wafer that includes a plurality of sensor structures and contact areas selectively interconnected and formed on a surface thereof is provided. A first header assembly coupled to the sensor wafer includes a plurality of pins, each of which are electrically coupled to an associated contact area. A second header assembly is coupled to the first assembly and to a sleeve, and includes a plurality of tubes into each of which one of the plurality of pins is positioned. A temperature insulated cable is partially positioned within the sleeve and includes a plurality of wires coupled to the pins. A third header apparatus is coupled to the sleeve and includes a plurality of closed-ended tubes for serving as leads, where each one of the plurality of wires is partially positioned in and coupled to a respective closed-end tube.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.