Multi-station rotary die handling device
US6364089B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 10, 1999 |
| Grant date | Apr 2, 2002 |
| Priority date | — |
| Expiry date | Dec 10, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6838
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to apparatus and methods for semiconductor device handling. In one aspect, the invention relates to a rotary flipper including a wheel having a plurality of stations. A semiconductor device is placed within a first station in a first orientation. While the semiconductor device is held, the wheel portion of the rotary flipper rotates and the next station receives another semiconductor device. When the first station is in an unloading position, the semiconductor device is released. At this point, the semiconductor device is oriented in a second position. In one aspect, the semiconductor device is released into a cavity of a tape and reel. In another aspect, vacuum pressure is applied to hold the die. In one embodiment, the invention relates to a semiconductor device handling apparatus and apparatus that includes of a rotary semiconductor device flipper.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.