Patent · US Expired

Chip card having a contact zone and method of producing such a chip card

US6364205B1 · kind B1 · utility

2Cited by

5References

10Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Thies Janczek · Molfsee, DE
Peter Stampka · Burglengenfeld, DE

Key dates

Filing date	Apr 15, 1999
Grant date	Apr 2, 2002
Priority date	—
Expiry date	Apr 15, 2019

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/31504
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

A chip card has a contact zone on which an electrically conductive lacquer applied. The electrically conductive lacquer is based on an intrinsically conductive plastic material. Pigments are added to the electrically conductive lacquer. In an alternative embodiment an electrically nonconductive lacquer is applied to the contact zone. Conductive particles are disposed in the electrically nonconductive lacquer. The electrically conductive lacquer forms a covering for the conductive particles. A method of lacquering a contact zone and a method of producing a chip card are also provided.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.