Patent · US Expired

Plastic compositions for sheathing a metal or semiconductor body

US6365269B1 · kind B1 · utility

10Cited by

11References

21Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Alexandra Atzesdorfer · Weil am Rhein, DE
Klaus Heckmann · Nittendorf, DE
Josef Thumbs · Johanngeorgenstadt, DE

Key dates

Filing date	Nov 20, 1998
Grant date	Apr 2, 2002
Priority date	—
Expiry date	Nov 20, 2018

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/31678
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

The adhesion of plastic to metal surfaces is improved by adding a specific filler in the sheathing material. The filler is formed of spherical SiO2 particles with a graduated diameter distribution defining individual diameter stages wherein the standard deviation in mean particle diameter of at least one diameter stage of said SiO2 particles is less than 10%. Spherical SiO2 particles with a graduated diameter distribution defining individual diameter stages are also mixed together in such ratio to obtain packing densities of 90% or more. Said spherical SiO2 particles with a graduated diameter distribution defining individual diameter stages may also be characterized as having an index of refraction which increases from the center of a particle to the surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.