Thermoelectrically cooling electronic devices
US6365821B1 · kind B1 · utility
16Cited by
0References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 24, 2000 |
| Grant date | Apr 2, 2002 |
| Priority date | — |
| Expiry date | Jul 24, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S257/93
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermoelectric cooler utilizing superlattice and quantum-well materials may be deposited directly onto a die using thin-film deposition techniques. The materials may have a figure-of-merit of greater than one.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.