Wafer holder for semiconductor manufacturing apparatus
US6365879B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 7, 2000 |
| Grant date | Apr 2, 2002 |
| Priority date | — |
| Expiry date | Nov 7, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67103
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer holder includes a heater interposed between at least one pair of ceramic base members. The wafer holder can be regarded as including a holding surface side structure on a side of the heater facing toward the wafer, and a backside structure on the opposite side of the heater. The backside structure has a heat insulating character. The ceramic base member in the backside structure is formed of ceramic having a lower heat conductivity than that of the ceramic base member in the holding surface side structure. Further, the ceramic base member in the backside structure has a heat conductivity of 100 W/mK or less and a joint layer has a heat conductivity of 10 W/mK or less. In this way, the wafer holder prevents heat from spreading toward the backside of the wafer holder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.