Photoresist frame plating method for forming planarized magnetic pole layer
US6367146B1 · kind B1 · utility
3Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 17, 1996 |
| Grant date | Apr 9, 2002 |
| Priority date | — |
| Expiry date | Apr 17, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49046
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method comprises the step of providing a read-write element on a wafer including at least one magnetoresistive stripe, providing a shared pole layer above the magnetoresistive stripe, and planarizing the shared pole layer. Thereafter, a top pole layer is formed above the shared pole layer. Together, the shared and top pole layers form the write element. Because the shared pole layer is planarized, the gap portion of the write element between the shared and top pole layers is flat. Because of this, improved recording density can be achieved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.