Semiconductor processing article
US6368410B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 1999 |
| Grant date | Apr 9, 2002 |
| Priority date | — |
| Expiry date | Jun 28, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03C2204/08
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A semiconductor processing article is characterized by extended useful life. The article is used in a semiconductor furnace system, particularly in a low pressure chemical vapor deposition furnace for prolonged periods without requiring cleaning to remove build-up film. The semiconductor processing article is a quartz body characterized by a surface roughness having a first component with an average deviation from a first mean surface of about 2.5 to 50 microns, and a second component with an average deviation from a second mean surface of about 0.25 to 5 microns. The processing article is prepared for use in the furnace by mechanically blasting and chemically etching the surface of the article.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.