Composition for stripping photoresist and organic materials from substrate surfaces
US6368421B1 · kind B1 · utility
7Cited by
26References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 10, 1998 |
| Grant date | Apr 9, 2002 |
| Priority date | — |
| Expiry date | Jul 10, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/426
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The invention relates to the field of microelectronics, such as integrated circuits, and more particularly to compositions and methods of removing photoresists or other organic materials from the surfaces of substrates used in the fabrication of integrated circuits. In particular the present invention relates to amine-free stripping compositions comprising solvent and surfactant that can effectively remove organic materials without corroding the underlying substrate, and the invention also relates to methods for removing these organic materials with the novel stripping composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.