Solder balls and columns with stratified underfills on substrate for flip chip joining
US6369451B2 · kind B2 · utility
Inventor
Key dates
| Filing date | Jan 12, 1999 |
| Grant date | Apr 9, 2002 |
| Priority date | — |
| Expiry date | Jan 12, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention discloses an improved method for carry out a flip chip packaging process for attaching a semiconductor integrated circuit (IC) wafer having a plurality of input/output terminals, to a substrate. The method includes the steps of: 1) securely placing a plurality of solder balls on the substrate with each of said solder balls corresponding to a location of one of the input/output terminals on the integrated circuit wafer; 2) flipping the integrated circuit wafer for aligning each of the input/output terminals of the IC wafer to one of the solder balls; and 3) mounting the IC wafer onto the substrate for placing the I/O terminals on a corresponding solder ball and applying a reflow temperature for soldering the IC wafer to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.