Patent · US Expired

Method for manufacturing a micromechanical device

US6369931B1 · kind B1 · utility

32Cited by
14References
14Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 18, 1999
Grant dateApr 9, 2002
Priority date
Expiry dateAug 18, 2019

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB81C2201/019
  • WIPO fieldMicro-structural and nano-technology
  • WIPO sectorChemistry

Abstract

A method for manufacturing a micromechanical device, in particular a micromechanical vibrating-mirror device, having the following steps: making available a three-layer structure having a first layer, a second layer and a third layer, the second layer lying between the first and the third layers; etching through the first layer up to the second layer to produce an island region, lying on the second layer, which is joined to region of the first layer surrounding the island region by way of one or more connecting webs, and etching through a region of the third layer up to the second layer and removing a region of the second layer below the island region in such a way that the island region can perform movements, preferably torsional vibrations, about the one or more connecting webs, the torsional vibrations having such an amplitude that a part of the island region extends into the etched-through region of the third layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.