Arrangement for the testing of semiconductor structures

US6373272B1 · kind B1 · utility

Assignee

• Karl Suss Dresden GmbH · DE

Inventors

• Reinhard Welsch · Dresden, DE
• Claus Dietrich · Sacka, DE
• Thomas Huelsmann · Garching bei München, DE
• Dietmar Runge · Großerkmannsdorf, DE

Key dates

• Filing date: Sep 16, 1998
• Grant date: Apr 16, 2002
• Expiry date: Sep 16, 2018

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R31/2887
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

The present invention provides an apparatus for the testing of semiconductor structures. The apparatus is provided with a chuck for holding a semiconductor wafer and with needle holders for contact needles, the chuck being provided with a fastening device for the semiconductor wafer and being movable for positioning, controlled using a positioning device, in relation to the contact needles. The object of the present invention is to detect faults, in good time and reliably, of non-serviceable or not fully serviceable chips before separation to avoid unnecessary work for separating and assembling defective chips. The object is attained in that the chuck has a receiving area exposing upwards a lower surface of the semiconductor wafer and a receiving plane therefor. The receiving plane is arranged above the needle carrier, and the contact needles point upwards in such a manner that they contact contact islands of the semiconductor chips on the downwardly directed upper surface of the semiconductor wafer.