ELECTROSTATIC OR MECHANICAL CHUCK ASSEMBLY CONFERRING IMPROVED TEMPERATURE UNIFORMITY ONTO WORKPIECES HELD THEREBY, WORKPIECE PROCESSING TECHNOLOGY AND/OR APPARATUS CONTAINING THE SAME, AND METHOD(S) FOR HOLDING AND/OR PROCESSING A WORKPIECE WITH THE SAME
US6373679B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 2, 1999 |
| Grant date | Apr 16, 2002 |
| Priority date | — |
| Expiry date | Jul 2, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02N13/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrostatic or mechanical chuck assembly includes gas inlets only in an annulus-shaped peripheral portion and not in the central region of the chuck. The gas inlets are in fluid communication with one or more gas conduits and supply of the backside of a workpiece, such as a semiconductor wafer, with inert coolant gas or gases. The gas or gases supplied only to the peripheral region of the chuck effectively cool the central region of the chuck by at least two physical mechanisms, including the thermal conduction through the workpiece and diffusion of the gas or gases in the interstitial space(s) between the somewhat irregular facing surfaces of the chuck and of the backside of the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.