Substrate processing method and processing apparatus
US6374834B1 · kind B1 · utility
6Cited by
4References
13Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jul 31, 2000 |
| Grant date | Apr 23, 2002 |
| Priority date | — |
| Expiry date | Oct 13, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This invention provides a cleaning method of cleaning a laser mark formed on a semiconductor wafer. A semiconductor wafer is rotated in a circumferential direction, and a laser mark is detected indirectly or directly in a non-contact manner. Rotation of the semiconductor wafer is controlled on the basis of detection of the laser mark, and an ultrasonic vibration-applied processing solution is sprayed to the laser mark.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.