Apparatus and packaging method to assemble optical modules to a common substrate with adjustable plugs
US6375365B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 28, 2000 |
| Grant date | Apr 23, 2002 |
| Priority date | — |
| Expiry date | Feb 28, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
For any optically interconnected assembly, the packaging tasks include alignment of one or multiple optical devices, and attachment of aligned modules to a common substrate. The concept disclosed here is a packaging method to assemble pre-aligned optical modules on a common structure called motherboard. The apparatus consists of two components: device carrier or motherboard with openings on the sides and adjustable plugs in the form of pins or balls. The method and apparatus utilize plugs as connection bridges between device carriers and motherboard, allowing solid contacts and a rigid aligned structure among modules. The direct benefits include relaxation of dimensional tolerances on parts and elimination of the need for high-precision spacers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.