Polishing system having a multi-phase polishing substrate and methods relating thereto
US6375559B1 · kind B1 · utility
25Cited by
12References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 27, 1999 |
| Grant date | Apr 23, 2002 |
| Priority date | — |
| Expiry date | Aug 27, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B23/0021
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical-mechanical polishing system which is particularly well suited for use in the manufacture of semiconductor devices or the like. The invention is directed to a polishing pad composition comprising a high modulus phase component and a low modulus phase component. The multi-phase polishing pads are very efficient and effective in providing high performance polishing along an entire polishing surface interface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.