Plasma enhanced chemical processing reactor and method
US6375750B1 · kind B1 · utility
480Cited by
46References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 18, 2000 |
| Grant date | Apr 23, 2002 |
| Priority date | — |
| Expiry date | May 18, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/3322
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An apparatus for processing a substrate comprising a processing chamber and a substrate support system comprising an electrostatic chuck having a body portion and a substrate support surface and one or more arms extending from the body portion to mount the electrostatic chuck to a side wall portion of the processing chamber is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.