Ball grid array type package for semiconductor device
US6376907B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 1998 |
| Grant date | Apr 23, 2002 |
| Priority date | — |
| Expiry date | Nov 30, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16251
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device with a BGA package includes a substrate made of a resin and having one side on which a number of solder ball terminals are formed and the other side on which a chip mounting portion electrically connected to the solder ball terminals is formed, and a cover plate made of a metal and attached to a semiconductor chip so as to cover and come into contact with it under a condition where the semiconductor chip is connected to the resin substrate by a flip-chip process. The cover plate includes a base brought into contact with the semiconductor chip and a peripheral portion formed with a plurality of bonding portions where the cover plate is bonded to the substrate. The bonding portions are discontinuous to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.