Device for engraving and inspecting a semiconductor wafer identification mark
US6377866B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 4, 1997 |
| Grant date | Apr 23, 2002 |
| Priority date | — |
| Expiry date | Dec 4, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67282
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device operable to apply an identification mark to a semiconductor wafer and inspect the applied mark immediately after its application. Engraving information and wafer thickness data are suppled to an engraving device and the engraving operation applies the mark to the wafer accordingly. A camera then reads the applied mark as read information and a comparator compares the read information to the engraving information and an error is determined in an information processing device. In order to maintain efficient operation of the mark application process, the error determined in the information processing device is then used to control the engraving device as it applies identification marks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.