Reworkable high temperature adhesives
US6380322B1 · kind B1 · utility
12Cited by
9References
46Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 17, 1999 |
| Grant date | Apr 30, 2002 |
| Priority date | — |
| Expiry date | Jun 17, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A reworkable high temperature adhesive, comprising the reaction product of (a) a thermoplastic adhesive selected from the group consisting of polyetherimides, polyamide-imides, polysulfones, polyethersulfones, silicon-carbon thermosets, polyphenylene sulfides and mixtures thereof; (b) a metal acetonate; (c) an epoxy resin; (d) a crosslinker; (e) and a catalyst.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.