Loop heat pipe for mobile computers
US6381135B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 20, 2001 |
| Grant date | Apr 30, 2002 |
| Priority date | — |
| Expiry date | Mar 20, 2021 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28D15/043
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat transfer device for a mobile computer system using a loop heat pipe, the evaporator of the loop heat pipe coupled to the processor die. The vapor space and liquid space are separated. The separation of the vapor space, and the wick structure of the liquid space, ensures that the vapor space will not be distorted or clogged by the wick structure. The heat transfer device can be bent to meet design criteria without distorting the width or radius of the vapor space. In one embodiment of the present invention the evaporator, condenser, and liquid space have different types of wick structure. Another embodiment of the present invention, the vapor space of the loop heat pipe has uniform thickness. The loop heat pipe device of the present invention provides reduced evaporator and condenser resistance and increased burn out flux, thereby increasing the power handling capacity of the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.