Method for making an electronic circuit assembly
US6381837B1 · kind B1 · utility
14Cited by
11References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 4, 1998 |
| Grant date | May 7, 2002 |
| Priority date | — |
| Expiry date | Sep 4, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for producing an electronic circuit assembly (e.g., a circuit board) from an etched tri-metal-layer structure which provides air bridge crossovers and specially designed bumps etched from a middle layer of the tri-metal-layer structure. The bumps are formed at particular circuit locations in order to provide interconnects for (1) heavy wirebonding, (2) fine wirebonding, or (3) direct chip attachment; or, to provide (4) lifters for assuring a minimum solder joint standoff height or (5) barriers for retarding solder joint crack propagation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.