Nonconductive substrate forming a strip or a panel on which a multiplicity of carrier elements is formed

US6384425B1 · kind B1 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Michael Huber · Bad Abbach, DE
• Peter Stampka · Burglengenfeld, DE
• Gerhard Schraud · Mering, DE
• Peter Striegel · Hersbruck, DE
• Hans-Georg Mensch · Neunburg vorm Wald, DE

Key dates

• Filing date: Aug 20, 1998
• Grant date: May 7, 2002
• Expiry date: Aug 20, 2018

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K3/0097
• WIPO field: Computer technology
• WIPO sector: Electrical engineering

Abstract

A nonconductive substrate forms a strip or a panel on which a multiplicity of carrier elements is formed, in particular for installation in a chipcard. One side of the substrate is provided with conductive contact surfaces which lie within an outer contour line that determines the size of a carrier element. The other side of the substrate has conductor structures within the outer contour line which form at least contact fields for at least one coil to be contacted and for at least one semiconductor chip. The substrate has cut-outs outside each outer contour line, through which it is possible to access coil terminals of the semiconductor chip for testing purposes from the contact-surface side, as long as the carrier element is still in the strip or in the panel.