Dual dielectric structure for suppressing lateral leakage current in high fill factor arrays
US6384461B1 · kind B1 · utility
14Cited by
2References
6Claims
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Key dates
| Filing date | Oct 15, 1999 |
| Grant date | May 7, 2002 |
| Priority date | — |
| Expiry date | Oct 15, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/548
Abstract
A structure and method for suppressing lateral leakage current in full fill factor image arrays includes dual dielectric passivation layer. A first passivation layer includes a material that is an insulator, has a low dielectric constant to minimize capacitive coupling between the contacts, and is low stress to prevent cracking. A second passivation layer includes a thin oxide or nitride layer over the first passivation layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.