Multi-board BGA package
US6385049B1 · kind B1 · utility
59Cited by
8References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 5, 2001 |
| Grant date | May 7, 2002 |
| Priority date | — |
| Expiry date | Jul 5, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi-board BGA package comprises a chip, a plurality of circuit boards, a plurality of metal bonding wires, a plurality of solder balls, and a package body. The circuit boards are formed on a same plane. Between adjacent circuit boards there is a galley for passing through metal bonding wires to connect chip with circuit board and molding package body easily. The plurality of circuit boards together hold the chip so as to reduce thermal stress caused by CTE mismatch.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.