Semiconductor die pickup method that prevents electrostatic discharge
US6386432B1 · kind B1 · utility
8Cited by
16References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2000 |
| Grant date | May 14, 2002 |
| Priority date | — |
| Expiry date | Nov 10, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53191
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An embodiment of the present invention provides a pickup tool in accordance with the present invention includes multiple contact parts, which contact a passivation layer of a semiconductor chip so that the contact parts are far from chip pads and fuses when holding the semiconductor chip. Furthermore, a die bonding apparatus has one or two pickup tools, an aligning stage, and a bond stage or a bond head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.