Printed circuit board to module mounting and interconnecting structure and method
US6386890B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2001 |
| Grant date | May 14, 2002 |
| Priority date | — |
| Expiry date | Mar 12, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/7047
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention provides a method and structure for connecting a module to a printed circuit board, wherein a substantially rigid interposer having resilient conductors is disposed between a module and a printed circuit board. A clamping means urges the module and printed circuit board toward each other with compressive force upon an interposer positioned therebetween, preferably causing the module and printed circuit board to deform and thereby align their electrical contacts with the surfaces of the interposer. The interposer further comprises a plurality of apertures, each aperture further having a deformable resilient conductor means for connecting a module contact to a PCB contact. The conductor is deformable in shear, which may travel and, therefore, makeup the CTE dimensional mismatch between the module and the PCB. The conductors are detachable, electrically connecting the module and PCB contacts without the requirement of solder or other permanent means.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.