Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structures formed thereby
US6388203B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 24, 1998 |
| Grant date | May 14, 2002 |
| Priority date | — |
| Expiry date | Jul 24, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A controlled-shaped solder reservoir provides additional solder to a bump in the flow step for increasing the volume of solder forming the solder bump. The controlled shaped reservoirs can be shaped and sized to provide predetermined amounts of solder to the solder bump. Thus, the height of the resulting solder bump can be predetermined. The solder reservoirs can be shaped to take a minimum amount of space, such as by at least partially wrapping around the solder bump. Consequently, the solder bumps may have increased height without adding to the space requirements of the solder bump, or without increasing the fabrication cost. In addition, due to the finite time required for solder flow, a means of sequencing events during soldering is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.